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Fingerprint sensors manufacturing
Silicon sensors are fabricated in large clean rooms, then assembled.
SMIC: FPC, Silead
TSMC: Apple-Authentec, Synaptics
UMC: IDEX, EgisTech
WLCSP (China Wafer Level CSP Co. Ltd.)
is offering integrated ultrathin fingerprint module, using wafer level interconnect methods,
advanced module manufacturing and many other sophisticated sensor packaging related technologies.
is offering the High-K (15!) Epoxy Molding Compound GT-308 for fingerprint sensors.
O-Film tech is offering packaging solutions.
Largest fingerprint identification plant (2014 Nov).
(2015) You will find valuable information on Serapeum blog (korean).